Tungsten Copper Alloy

Electronic encapsulation materials

• High heat conductivity, can quickly to the heat generated by the export electronic device

• Semiconductor materials that match the thermal expansion coefficient (2 ~ 6 W/m.K), avoid and electronic device interface of thermal stress and thermal fatigue

• Containing a large number of high hardness ceramic or metal particles, difficult processing

●    Solution

• Powder injection molding (tungsten copper, kovar alloy, invar alloy, aluminum and silicon carbide, aluminum nitride, etc.)

• Interface structure control, and improve the thermal performance

Application of MIM Process:

●    can direct sintering: tungsten copper alloy, kovar alloy, invar alloy, aluminum nitride

●    aluminized after sintering: aluminum and silicon carbide, copper - diamond

Tungsten-copper alloy - Advantages: Tungsten-copper alloy

●    High strength

●    High proportion

●    High temperature resistant

●    Arc ablation resistance

●    Conductive electric performance is good

Tungsten copper alloy - Purpose:

●    Military high temperature resistant material

●    5g optical material

●    Electrical alloy used in high pressure switch

●    Machining electrode

●    Microelectronics materials